Next-Generation Wired And Wireless Networks
Intel Outlines Evolution Of Next-Generation Wired And Wireless Networks
During their keynote at the Intel Developer Forum (IDF) in San Jose, Intel’s top two communications silicon executives have outlined the company’s strategies to enable richer applications and services for next-generation wired and wireless networks.
Intel has created two communication silicon architectures aimed at speeding the development of new communication equipment and wireless clients that address the opportunities emerging from the convergence of voice and data networks. The Intel® Internet Exchange Architecture (Intel IXA) addresses the network infrastructure needs of next-generation networks. The Intel® Personal Internet Client Architecture (Intel® PCA) will speed the transition to next-generation wireless clients.
The need for greater Internet bandwidth is being driven by the rapid growth of wireless devices, continued growth in wired Internet access, and the convergence of voice and data over next-generation networks. This explosion of digital data over the Internet creates a market opportunity for Intel’s communications silicon components.
“Intel is a leading supplier of
communications silicon technologies to the networking and
wireless communications industries, and has the expertise
and variety of products to successfully develop
next-generation networks,” said Ron Smith, senior vice
president and general manager
of Intel’s Wireless
Computing and Communications Group. “Intel IXA and Intel PCA
are the cornerstones of that strategy, and these
architectures are gaining continual momentum and support in
the marketplace.”
New Additions to Intel’s Communications
Silicon Product Families
Mark Christensen, vice president
and general manager of Intel’s Network Communications Group,
demonstrated the world’s first single-chip Gigabit Ethernet
solution for PCs, servers and network infrastructure
equipment. The new chip is less than half the size and uses
half the power of previous Gigabit Ethernet
solutions.
Christensen also unveiled Intel’s latest array
of components for optical networking systems vendors that
give telecommunications service providers the ability to
extend the reach of their optical networks, add intelligence
to those networks and deliver new telecommunications
services. These new semiconductors use a technology called
“forward error correction” to increase the distance that
data can travel over optical networks by up to 400 percent
without having to install expensive repeaters that boost the
signal of traffic traveling long distances over fiber optic
cables. These components can also receive and transmit data
over multiple communications protocols that service
providers have to support on their networks today.
“These new products demonstrate the breadth of the Intel IXA product line,” said Christensen. “When connecting PCs and servers to the network, the Intel IXA product line can intelligently move terabits of data across an optical backbone. Intel has the most comprehensive set of silicon and software solutions for enabling network equipment manufacturers to rapidly develop next-generation network equipment.”
Intel’s wireless building block components can
be used to develop handheld
devices taking advantage of
Intel PCA. The Intel® StrongARM** processor and future
processors using the Intel® XScale™ microarchitecture are
ideal for processing solutions that need high performance
and low power consumption. Intel also offers cellular
baseband chipsets and high-speed flash memory for the
communications market.
Smith introduced a new addition to
the company’s flash memory family, the Intel Persistent
Storage Manager (PSM), version 3.0 software. Coupled with
Intel StrataFlash™ Memory,
PSM serves as a flash file and
media manager that enables code execution, file storage and
registry back-up.
The software is specifically aimed at handheld devices using Microsoft’s Windows* CE operating system.
“Intel Persistent Storage Manager software simplifies design by combining all nonvolatile memory functions into a single memory solution,” said Smith. “This optimization reduces power consumption, component count and manufacturing costs, while providing increased system reliability and valuable user storage.”
Smith also
announced the availability of Intel Integrated Performance
Primitives
(IPP) for Intel StrongARM and Intel XScale
processors, which enable designers to quickly
develop
applications that can be ported to run on any Intel
processor. During the keynote address, Thomas Dolby
Robertson, the founder of Beatnik Inc., demonstrated the
Beatnik Audio Engine* for Intel StrongARM, one of the first
technologies optimized using the IPP software libraries to
enable users to experience CD-quality audio and music
through a variety of digital devices.
About IDF
The
Intel Developer Forum is Intel's premier technical
conference, featuring more than 250 sessions and hands-on
labs, along with numerous demonstrations of cutting-edge
products and technologies. Now in its fifth year, the
semi-annual conference provides hardware original equipment
manufacturers, and independent hardware and software vendors
with in-depth information on Intel technologies and
initiatives.